Reversible bonding of microfluidics: Review and applications

With the development of microfluidic technology, new materials and fabrication methods have been constantly invented in field microfluidics. Bonding is one key steps for enclosed-channel chips, which extensively explored by researchers globally. The main purpose bonding to seal/enclose fabricated microchannels subsequent fluid manipulations. Conventional are usually irreversible, forced detachment substrate cover plate may lead structural damage chip. Some current applications require reversible reuse chip or retrieve contents inside Therefore, it essential develop meet requirements various applications. This review introduces most recent developments microfluidics their corresponding Finally, perspective outlook technology were discussed this review.